The Ottawa-headquartered company closed a seed round to commercialize its power interconnects—the connections between the thousands of chips at the heart of an AI data centre. ArcTern Ventures and BDC’s Deep Tech Venture Fund led the round, with additional investors MUUS Climate Partners, SOSV, Intel Capital, and LG Technology Ventures, according to a release Wednesday. (The Logic)
Talking point: The company, co-founded by Mohsen Asad and Hossein Fariborzi in 2022, is developing faster, cheaper and more energy-efficient interconnects. Its technology will address the “connectivity bottlenecks” facing existing interconnects, according to the press release. “As the demand for AI grows, so do its energy requirements, placing a significant burden on traditional copper interconnects,” said Srini Ananth, managing director at Intel Capital.