The U.S. Commerce Department will give the Taiwanese semiconductor giant US$6.6 billion in direct funding and US$5 billion in loans for the US$65-billion-plus buildout of three fabrication facilities in Phoenix, one of which was announced on Monday. (The Logic)
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The U.S. Commerce Department will give the Taiwanese semiconductor giant US$6.6 billion in direct funding and US$5 billion in loans for the US$65-billion-plus buildout of three fabrication facilities in Phoenix, one of which was announced on Monday. (The Logic)
Talking point: Taiwan Semiconductor Manufacturing Company (TSMC) currently makes most of the world’s most advanced chips, almost all domestically. Two of its new U.S. plants will produce semiconductors using a two-nanometre process, the next generation of advanced chips designed to power consumer electronics and AI tools. It’s the kind of leading-edge component the Biden administration’s US$52.7-billion CHIPS and Science Act was meant to reshore. Washington previously announced a US$19.5-billion financing agreement with Intel for fabs or R&D in four states, and a US$3.1-billion deal with GlobalFoundries.
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